Uart Display Module
Chip On Glass
Chip-on-board
COB (Chip-on-board) is an integrated circuit packaging technology that connects the Chip directly to the surface of the printed circuit Board (PCB), rather than using traditional chip packaging. In a COB package, the chip is exposed on the PCB surface, then wires are used to connect the solder points of the chip to the corresponding locations on the PCB. This packaging technology enables more compact, thinner board designs and improves circuit reliability and durability.
COB technology is often used in applications that require highly at cost, space and reliability, such as LED lighting, sensors, displays and wireless communication devices. Because COB packaging eliminates the package volume in traditional chip packaging, it allows for greater flexibility in miniaturized design. In addition, the COB package can also provide a shorter circuit connection path, reducing the delay of signal transmission, thereby improving performance and efficiency.
Advantages
COB packaging technology has obvious advantages in size, cost, heat dissipation, electrical performance, durability and reliability, making it widely used in many electronic devices.
Compact Size
The COB package allows the chip to be connected directly to the PCB surface, eliminating the need for the shell of a traditional package, thus enabling a more compact board design for space-constrained applications.
Cost Effective
COB packaging eliminates the shell and pins required for traditional packaging, reducing material costs while simplifying the manufacturing process and reducing production costs.
Optimized Heat Dissipation
The chip directly connected to the PCB surface can dissipate heat more effectively, improving the working stability and reliability of the chip.
Electrical Performance Optimization
The COB package eliminates the resistance and inductance of the chip pin in the traditional package, reduces the resistance of the signal transmission path and improves the performance and efficiency of the circuit.
Increased Durability
The chip in the COB package is directly exposed on the PCB surface, reducing the package volume and mechanical stress, thus improving the seismic and impact resistance of the product.
Enhanced Reliability
The COB package simplifies the connection process, reduces the connection point, reduces the failure rate caused by connection failure and improves the reliability and life of the product.
Disadvantages
Despite the many advantages of COB packaging technology, there are some potential disadvantages in terms of repair, testing, welding technology, environmental sensitivity, design limitations and reliability, which need to be considered and balanced in practical applications.
Difficult to Repair
Since the chip is exposed on the PCB surface, it becomes more difficult to repair and replace the chip in the event of a failure, requiring more sophisticated tools and techniques.
Testing Difficulty
COB packaging hides the internal structure of the chip, making it difficult to carry out comprehensive testing and inspection during the manufacturing process, increasing the difficulty of troubleshooting.
High Welding Technical Requirements
COB package needs to connect the chip welding point to the PCB, the welding technology and process requirements are high, once poor welding may lead to performance problems or failures.
Environmental Sensitivity
The chip in the COB package is exposed and susceptible to moisture, dust and chemicals in the environment, increasing the risk of damage and failure of the chip.
Design Limitations
COB packaging needs to consider factors such as the gap between the chip and the PCB and the coefficient of thermal expansion.The design is complex, which may limit the overall design and performance optimization of the product.
Reliability Affected
The chip in the COB package is directly exposed and vulnerable to mechanical vibration and shock, reducing the overall reliability and durability of the product.
Application
COB screen technology is not only widely used in large display devices but also excels in small screens and compact devices. It is commonly found in smartwatches and wearable devices, offering high brightness, low power consumption, and ultra-high resolution for excellent HD display while extending battery life. In smartphones and tablets, COB screens ensure precise color reproduction and contrast, with a compact design that contributes to a thinner and lighter form factor. Additionally, COB screens are utilized in small appliances and smart home devices like smart speakers and thermostats, providing clear status indicators and control interfaces.
In automotive displays, as well as virtual reality (VR) and augmented reality (AR) devices, COB screens deliver an immersive visual experience with high resolution and fast response times, enhancing readability and overall user experience. In the medical field, COB screens are used in portable devices to offer clear, reliable readings while minimizing power consumption and extending operational life. These applications highlight the importance of COB screens in small devices, offering HD, durable, and energy-efficient display solutions for portable and embedded technologies.
Introduction of FSTN/FTN monochrome blue screen LCD COB display module serial port MPU parallel port 1602 dot matrix LCD
GK POS
Landline Phone
Forehead Thermometer
Punch Clock
Disadvantages
COB Display
Wide Used
Simple Operation
Programmable
Shorten the Customization Cycle
TECHNICAL
SPECIFICATIONS
| Display Font
5*8 Dots |
Display Format
16 Characters*2 Lines |
Storage Temperature
-30℃~80℃ |
| Viewing Direction
6 o’clock |
Control IC
AIP31066,AIP31065 |
Operating Temperature
-20℃~70℃ |
| Input Voltage
4.7V |
Driving Scheme
1/16 Duty, 1/5 Bias |
Power Supply
Single Power Supply(+5V) |
| Model
Sin Yellow Green Transmission Positive |
COB Principle
COB (Chip-on-board) packaging technology is a packaging method that connects the Chip directly to the surface of the printed circuit Board (PCB). The basic principles are as follows:
Prepare the PCB
First prepare a PCB, usually coated with a layer of conductive material on its surface for connecting the chip.
Chip Mounting
The chip is placed in a reserved position on the PCB surface and a conductive glue or welding technology is used to fix the chip to the PCB.
Welding Connection
The welding point of the chip (bond pads) is connected with the corresponding bond pads on the surface of the PCB using welding technology. This usually involves coating the PCB with solder paste, then placing the chip on it and melting the solder paste by heating it to form a welded connection.
Package Protection
A layer of protective packaging material can be applied around the chip or over the entire PCB surface to protect the chip and connection lines from mechanical damage or environmental impacts.
In general, COB packaging technology achieves a simplified packaging process by connecting the chip directly to the PCB surface, improving the integration and reliability of the circuit. It is suitable for applications with high requirements of size, cost and performance requirements, such as LED lighting, sensors, displays, etc.
COB Process Flow
In addition, we can provide a variety of COB products with different parameters according to your requirements. Whether you need a specific size, power, operating frequency or other customized requirements, we can meet your needs. We have a professional team and advanced production equipment, can flexibly customize various specifications of COB products, to ensure product quality and performance to meet your expectations.
Tell us what you need
15 years of production experience.Production and independent development capabilities.
Support sampling and customization
Customized according to demand
Professional customer service team
Provide professional solutions
Short delivery time
Advanced production equipment
Source factory
Super affordable price
After-sales service
Good after-sales team
Get Started with Kaihang Display
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